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ABOUT US

ABOUT ZHONGSHI

Nominated Supplier of China Aerospace and Defence companies

Company Profile

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Company Profile

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Company Philosophy

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Social Responsibility

Kindness,Benevolence Love,Sincerity

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PRODUCTS

PRODUCTS

All Real Products guide

Oxygen-free copper

Solder Preforms

Solder Paste

Solder Wire

Solder Bar

BGA Ball

Flux/Thinner/Cleaner

High Precision Copper Profiles

Oxygen-free copper

Gold-based Solder Preforms

Reinforced Solder Preforms

Silver-based Solder Preforms

Indium-based Solder Preforms

Lead-free Solder Preforms

Tin-lead Solder Preforms

Flux-Coated Preforms

Lead-free Solder paste

Halogen-free Solder paste

Tin Lead Solder paste

Low Silver High Reliability solder paste

High Strength Solder paste

Jetting Solder Paste

Solder Pastes for Laser Soldering

Micron Solder Powder

Lead-free Tin wire

Tin Lead tin wire

Tin Bar

BGA Ball

Flux

Thinner

Cleaner

Copper Fluted Wire
APPLICATION

APPLICATION

Provide Customized Solutions and services

Application
RESEARCH

SCIENTIFIC RESEARCH

Science & Technology Progress rapidly,And New products are constantly changing

Research Team

Industry University Research

Research Achievement

Research Team

Research Idea

Industry University Research

Research Achievement
SERVICE

SERVICE SUPPORT

Deep Cultivation of High-end solder industry head enterprise for more than 20 years

Security System

Marketing &d After-Sales

Security System

Omni Marketing Network

After Sales Service
CONTACT US

CONTACT US

To Provide You with professional consulting services

Contact Information

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Company Address

Talent System

Recruit Talents

Recruitment

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ABOUT US
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APPLICATION
RESEARCH
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CONTACT US

Application

Oxygen-free copper

Solder Preforms

Flux/Thinner/Cleaner

High Precision Copper Profiles

BGA Ball

BGA Ball

BGA Ball

This product is suitable for BGA, CSP, MCM and other IC packaging, but also used in other micro-welding.

PRODUCT SELECTION

DETAILED INTRODUCTION